Chip with metal post and encapsulating structure of chip with metal post

Chip with metal post and encapsulating structure of chip with metal post

  • CN 102,064,135 B
  • Filed: 10/21/2010
  • Issued: 07/22/2015
  • Est. Priority Date: 10/21/2010
  • Status: Active Grant
First Claim
Patent Images

1. there is a chip for metal column, comprising:

  • One chip body, has a surface;

    Several chip pad, is positioned at this surface;

    One protective layer, is adjacent to the surface of this chip body, and this protective layer has several opening, and these openings also expose these chip pad;

    One dielectric layer, between the surface of this chip body and this protective layer;

    Several ball lower metal layer, is positioned at these openings;

    AndSeveral metal column, these openings corresponding and be positioned on these ball lower metal layers, the side-play amount of the central shaft of this chip body central authorities'"'"' central shaft of metal column far away of its middle distance and this opening corresponding to it is larger, and the central shaft of this opening this metal column central shaft and this chip body central authorities between, to reduce the maximum of the tension stress outside these metal columns, and this dielectric layer is avoided to destroy or delamination.

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