Heat-transfer structure

Heat-transfer structure

  • CN 102,066,109 A
  • Filed: 06/18/2009
  • Published: 05/18/2011
  • Est. Priority Date: 06/20/2008
  • Status: Active Application
First Claim
Patent Images

1. device comprises:

  • First substrate has first surface;

    Second substrate has the second surface towards described first surface;

    AndBe positioned at the array of the metal bump feature on the described first surface, each protruding features contacts described first surface with described second surface, and the part of described protruding features is out of shape via compression stress.

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