Chip package and fabrication method thereof

Chip package and fabrication method thereof

  • CN 102,082,131 A
  • Filed: 03/09/2010
  • Published: 06/01/2011
  • Est. Priority Date: 12/01/2009
  • Status: Active Application
First Claim
Patent Images

1. a wafer encapsulation body is characterized in that, this wafer encapsulation body comprises:

  • The semiconductor substrate has an element region and a peripheral connection pad district, and this periphery connection pad district is around this element region;

    A plurality of conductive pads are arranged in this periphery connection pad district at this semiconductor-based end;

    One wafer protection layer was covered on this semiconductor-based end, and exposed described conductive pad;

    One insulating protective layer covers this element region;

    AndOne encapsulated layer is arranged on this insulating protective layer, and exposes described conductive pad.

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