Integrated circuit element and flip chip package

Integrated circuit element and flip chip package

  • CN 102,088,004 A
  • Filed: 11/05/2010
  • Published: 06/08/2011
  • Est. Priority Date: 11/05/2009
  • Status: Active Application
First Claim
Patent Images

1. integrated circuit component comprises:

  • The semiconductor substrate;

    One junction pad area is positioned on this semiconductor substrate;

    One bronze medal post projection is positioned on this junction pad area, and is electrically connected to this junction pad area;

    AndOne barrier layer is positioned on the surface of this copper post projection, and wherein this barrier layer is a copper-bearing materials layer, and this copper-bearing materials layer one of comprises in III family element, IV family element or the V group element at least.

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