Wafer polishing method and double side polishing apparatus

Wafer polishing method and double side polishing apparatus

  • CN 102,089,121 A
  • Filed: 06/30/2009
  • Published: 06/08/2011
  • Est. Priority Date: 07/31/2008
  • Status: Active Application
First Claim
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1. the Ginding process of a chip, at least, by the lower millstone of rotation driving, upper millstone and the carrier that rotation drives, come the clamping said chip, and push slip, thus, side by side grinding chip is two-sided, and this lower millstone has smooth grinding end face, this upper millstone is configured in the face of above-mentioned lower millstone and has smooth grinding bottom surface, this carrier has in order to keep the chip retaining hole of chip, and the Ginding process of this chip is characterised in thatOn one side the thickness of measuring said chip from the pivot that is located at above-mentioned upper millstone or above-mentioned lower millstone and a plurality of holes between the periphery grinds on one side, and in the grinding way of said chip, the different grinding milk of replacing grinding rate.

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