Method for encapsulating electronic components with a controllable closing force

Method for encapsulating electronic components with a controllable closing force

  • CN 102,099,170 A
  • Filed: 07/16/2009
  • Published: 06/15/2011
  • Est. Priority Date: 07/17/2008
  • Status: Active Application
First Claim
Patent Images

1. one kind is installed in the method for the electronic component on the bearing with encapsulating material encapsulation, comprises following treatment step:

  • A) electronic component that will encapsulate is placed on the mold members;

    B) with closing force some mold members are movable relative to each other, so that surround this electronic component that will encapsulate and between mold members, clamp this bearing by die cavity;

    C) pressurize on liquid encapsulating material with at least one piston so that encapsulating material is discharged to the die cavity that is used for sealing this electronic component;

    D) be full of die cavity with encapsulating material;

    And,E) in die cavity at least part divide ground cure package material;

    Wherein,Pressure on the encapsulating material is measured by at least one force sensors, and,The closing force that mold members is promoted relative to one another and put on pressure on the encapsulating material along with the time dynamically interdepends each other.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×