Power module assembly with reduced inductance

Power module assembly with reduced inductance

  • CN 102,110,680 A
  • Filed: 10/29/2010
  • Published: 06/29/2011
  • Est. Priority Date: 10/30/2009
  • Status: Active Application
First Claim
Patent Images

1. device comprises:

  • First electrically-conductive backing plate (102);

    Second electrically-conductive backing plate (104);

    First power semiconductor (118a), it has first thickness and electrical ties to described first electrically-conductive backing plate;

    Second power semiconductor (118b), it has second thickness and electrical ties to described second electrically-conductive backing plate;

    Positive terminal (142), its electrical ties is to described first electrically-conductive backing plate;

    Negative terminal (144), its electrical ties is to described second power semiconductor;

    AndLead-out terminal (146), its electrical ties is described first power semiconductor and described second electrically-conductive backing plate extremely,Wherein, described positive terminal and negative terminal, described first power semiconductor and second power semiconductor and described first electrically-conductive backing plate and second electrically-conductive backing plate merge in the common circuit loop, and are configured to make the width of described circuit loop at least one direction to be limited by in described first thickness or second thickness at least one.

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