Light emission device package and manufacturing method thereof

Light emission device package and manufacturing method thereof

  • CN 102,110,763 A
  • Filed: 11/30/2010
  • Published: 06/29/2011
  • Est. Priority Date: 11/30/2009
  • Status: Active Application
First Claim
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1. luminescent device encapsulation, this luminescent device encapsulation comprises:

  • Substrate, this substrate are provided with and are formed the through hole that penetrates described substrate;

    Radiator, this radiator is formed in the described through hole, and is configured to give prominence to such an extent that be higher than the surface of described substrate;

    The luminescent device chip, this luminescent device chip is arranged on the described radiator;

    AndSeal member, sealing parts are arranged on the described luminescent device chip, and are formed and comprise fluorescent grain or fluorophor.

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