Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device

Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device

  • CN 102,112,516 A
  • Filed: 07/23/2009
  • Published: 06/29/2011
  • Est. Priority Date: 07/29/2008
  • Status: Active Application
First Claim
Patent Images

1. an epoxy curing agent is characterized in that, comprises the following dendrimer of polybasic acid anhydride and hydroxyl value 550mgKOH/g.

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