Corrugated support chip assembled in plate-fin heat exchanger

Corrugated support chip assembled in plate-fin heat exchanger

  • CN 102,133,671 A
  • Filed: 01/19/2011
  • Published: 07/27/2011
  • Est. Priority Date: 01/19/2011
  • Status: Active Grant
First Claim
Patent Images

1. waveform support chip that is assemblied in the plate-fin heat exchanger, it is characterized in that:

  • described waveform support chip comprises interior ring (1-1), outer shroud (1-2), waveform plate body (1-3), and described interior ring (1-1) connects into ring-type with described outer shroud (1-2) by described waveform plate body (1-3).

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