The method of non-UV cake core mould attachment film and this chip dies of manufacture attachment film

The method of non-UV cake core mould attachment film and this chip dies of manufacture attachment film

  • CN 102,142,389 B
  • Filed: 12/22/2010
  • Issued: 07/29/2015
  • Est. Priority Date: 12/24/2009
  • Status: Active Grant
First Claim
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1. manufacture a method for chip dies attachment film, comprising:

  • Be incorporated into by the cutting rete of light-curing adhesive composition and will be adhered to the attachment layer on wafer, described cutting rete comprises and the attachment layer region of described attachment ply and the annular frame region with the upper surface exposed near described attachment layer;

    WithThe exposed upper surface in described annular frame region is entered to suppress the photocuring in described annular frame region, the photocuring of the described attachment layer region simultaneously causing described Oxygen Flow to be stopped by described attachment layer to make the Oxygen Flow as free radical scavenger to the back side illuminaton UV light of described cutting rete.

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