Method for producing a multifunctional dielectric layer on a substrate

Method for producing a multifunctional dielectric layer on a substrate

  • CN 102,157,440 A
  • Filed: 09/03/2004
  • Published: 08/17/2011
  • Est. Priority Date: 09/25/2003
  • Status: Active Application
First Claim
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1. One kind be used on the base material without the metal interconnected system that covers on prepare the method for multifunctional dielectric layer, it comprises:

  • After exposing metal interconnecting piece (3) by chemico-mechanical polishing (CMP), further metal level (5) is deposited on described base material and the described whole surface without the metal interconnecting piece (3) that covers,Cover the some parts of described further metal level, thereby prevent the oxidation in step subsequently of these parts, form thin metal layer resistance,Partly change into non-conductive metal oxide (7) dielectric layer with removing this further metal level that is capped part on the whole base material subsequently,The method is characterized in that, the described dielectric layer that forms on the described base material on some cross tie parts as barrier layer, and on other cross tie parts as being used for the integrated MIM dielectric of MIM capacitor.

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