Device and forming method thereof

Device and forming method thereof

  • CN 102,157,662 B
  • Filed: 05/27/2010
  • Issued: 08/03/2016
  • Est. Priority Date: 02/12/2010
  • Status: Active Grant
First Claim
Patent Images

1. an IC apparatus, including:

  • One substrate, including a front surface and a rear surface;

    One light-emitting device, is positioned on the front surface of this substrate, and wherein this light-emitting device includes;

    One first cover layer;

    One active layer, is positioned on this first cover layer;

    AndOne second cover layer, is positioned on this active layer;

    One first substrate perforation latch, extends to this front surface of this substrate from this rear surface of this substrate, and this first substrate perforation latch includes a first substrate perforation pin conductors;

    One second substrate perforation latch, this the second cover layer is extended to from this rear surface of this substrate, this second substrate perforation latch includes a second substrate perforation pin conductors and a sealing coat, and this sealing coat has electrically isolated the second substrate perforation pin conductors in this second substrate perforation latch and this substrate, this first cover layer and this active layer;

    Multiple false via holes of substrate latches, it is positioned at this substrate, extend to this front surface of this substrate from this rear surface of this substrate including one first false via holes of substrate latch, and adjacent to this first substrate perforation latch, and one second false via holes of substrate latch extend to this second cover layer from this rear surface of this substrate, and bore a hole latch adjacent to this second substrate;

    At least two solder bump is arranged at the rear surface of this substrate, and these two solder bumps are directly connected to this first substrate perforation latch and this second substrate perforation latch respectively, to apply a voltage to this light-emitting device;

    At least two dry joint tin projection is arranged at the rear surface of this substrate, and the plurality of solder bump is directly connected to this first false via holes of substrate latch respectively and this second false via holes of substrate is inserted, and those dry joint tin projections there is no current flowing;

    AndReverberation, wherein, this reverberation is formed by metal material, it is formed with opening in this reverberation to provide the space of this first substrate perforation latch, this second substrate perforation latch, those false via holes of substrate latches, those solder bumps and those dry joint tin projections, and this reverberation does not contact this first substrate perforation latch, this second substrate perforation latch, those false via holes of substrate latches, those solder bumps and those dry joint tin projections.

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