Method for the hot stamping of at least one conductor track onto a substrate, and substrate

Method for the hot stamping of at least one conductor track onto a substrate, and substrate

  • CN 102,165,853 B
  • Filed: 06/15/2009
  • Issued: 05/24/2017
  • Est. Priority Date: 07/31/2008
  • Status: Active Grant
First Claim
Patent Images

1. it is used at least one printed conductor(

  • 17)

    Hot pressing prints to substrate(

    1)

    On method, wherein conductive with least oneLayer(

    4)

    Film(

    3)

    By the impressing face with structuring(

    8)

    Impressing mould(

    7)

    In molding direction(

    16)

    On be pressed towards thisSubstrate(

    1)

    ,Characterized in that,The film(

    3)

    It is stamped and causes the printed conductor(

    17)

    Obtain a kind of three-dimensionally shaped, film(

    3)

    By impressingMould(

    7)

    Cutter blade sections(

    11)

    It is divided during being imprinted so that in the cutter blade sections(

    11)

    Below and/or in the bladeSection(

    11)

    Blade(

    12)

    Below in the substrate(

    1)

    On not remaining film(

    3)

    ,The wherein film(

    3)

    It is stamped so that the printed conductor(

    17)

    On the one hand it is forced into the substrate plane of projection(

    22)

    On, andOn the other hand at least one is forced into raised substrate plane(

    22)

    Adjacent substrate side wall(

    23)

    On.

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