Mold assembly for midsole and method of manufacturing same

Mold assembly for midsole and method of manufacturing same

  • CN 102,186,661 A
  • Filed: 10/12/2009
  • Published: 09/14/2011
  • Est. Priority Date: 10/16/2008
  • Status: Active Application
First Claim
Patent Images

1. die assembly that is used for midsole comprises:

  • Top, it has the upper recess that forms in the lower surface on described top;

    Insert, it has the upper surface that is configured to the described lower surface coupling on described top;

    First passage, form among its in described top and described insert, when described top and described insert contacted with each other, described first passage was communicated with and is communicated with described upper recess fluid with described one external fluid in described top and the described insert;

    The lower part, it has the lower concave part that forms in the upper surface of described lower part, and described upper surface is configured to the lower surface coupling with described insert;

    Second channel, form among its in described lower part and described insert, when described lower part and described insert contacted with each other, described second channel was communicated with and is communicated with described lower concave part fluid with described one external fluid in described lower part and the described insert.

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