Package structure

Package structure

  • CN 102,194,804 A
  • Filed: 08/13/2010
  • Published: 09/21/2011
  • Est. Priority Date: 03/04/2010
  • Status: Active Grant
First Claim
Patent Images

1. encapsulating structure comprises:

  • One first chip;

    One second chip is engaged to this first chip top, and wherein the size of this second chip is less than the size of this first chip;

    AndOne companion chip is engaged to above this first chip, and wherein this companion chip comprises a part around this second chip, and wherein should comprise a material by auxiliary wafer, and it is selected certainly in the group that is made up of silicon and metal in fact.

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