Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit

Light emitting device, method of manufacturing the light emitting device, light emitting device package, and lighting unit

  • CN 102,194,959 A
  • Filed: 01/26/2011
  • Published: 09/21/2011
  • Est. Priority Date: 03/10/2010
  • Status: Active Application
First Claim
Patent Images

1. luminescent device comprises:

  • Conductive support substrate;

    First reflector on the described conductive support substrate;

    Second reflector, wherein this second reflector is set on the side surface in described first reflector to small part;

    Ray structure on described first and second reflector, described ray structure comprise first conductive type semiconductor layer, second conductive type semiconductor layer and the active layer between described first conductive type semiconductor layer and described second conductive type semiconductor layer;

    AndElectrode on the described ray structure,Wherein, the described ray structure of the described second reflector Schottky contacts,Wherein, the part in described second reflector is set between described first reflector and the described conductive support substrate.

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