Low-inductance power semiconductor assembly

Low-inductance power semiconductor assembly

  • CN 102,195,458 A
  • Filed: 03/04/2011
  • Published: 09/21/2011
  • Est. Priority Date: 03/05/2010
  • Status: Active Application
First Claim
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1. power semiconductor assembly, described power semiconductor assembly has:

  • At least two branch arms (B1, B2, B3), described branch arm have respectively at least two power switchs (B1T-B3T, B1B-B3b), described power switch be connected to directly or indirectly the phase place output (Ph1, Ph2, Ph3) on,Wherein power switch (B1T-B3T, what B1B-B3b) in each all had at least two parallel connections is integrated in switch element in the semiconductor chip (1) respectively,Wherein power switch (B1T-B3T, B1B-B3b) in each all is arranged in the power semiconductor modular, and each power semiconductor modular arranges on first direction adjacent to each other,Wherein the semiconductor chip of power switch (1) is arranged in the relevant power semiconductor modular on the second direction perpendicular to the first direction trend adjacent to each other.

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