Manufacturing method of field emission device

Manufacturing method of field emission device

  • CN 102,201,309 A
  • Filed: 03/25/2010
  • Published: 09/28/2011
  • Est. Priority Date: 03/25/2010
  • Status: Active Grant
First Claim
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1. the preparation method of a field emission apparatus, it comprises:

  • One insulated substrate is provided, this insulated substrate comprise a first surface and with this first surface opposing second surface, and this insulated substrate has a plurality of perforates that run through this first surface and second surface;

    Each perforate of corresponding described insulated substrate is provided with at least one electron emitter, described at least one electron emitter comprises the field emission tip that a stiff end and links to each other with this stiff end, and this stiff end is fixed in the first surface of described insulated substrate, and this emission tip is extended in perforate by stiff end;

    AndForm a plurality of strip cathode electrodes on the first surface of described insulated substrate, these a plurality of cathode electrodes are fixed in the stiff end of described electron emitter between described insulated substrate and the described cathode electrode.

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