Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

  • CN 102,215,994 A
  • Filed: 10/30/2009
  • Published: 10/12/2011
  • Est. Priority Date: 10/31/2008
  • Status: Active Application
First Claim
Patent Images

1. template device (200) that is used to prepare bonding line, this template device comprises:

  • Main body is made of semi-conducting material (201);

    AndTemplate opening (202) extends through this main body and has diameter, at least one section along the depth direction of this template opening (202), this diameter be mutually should bonding line (252A) aimed dia.

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