Method for enhancing sharpness of wafer ID

Method for enhancing sharpness of wafer ID

  • CN 102,222,601 A
  • Filed: 04/14/2010
  • Published: 10/19/2011
  • Est. Priority Date: 04/14/2010
  • Status: Active Application
First Claim
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1. a method that strengthens wafer identification code definition is characterized in that, comprises the steps:

  • Provide surface coverage that the wafer of first passivation layer is arranged;

    On described first passivation layer, form the aluminium film;

    The described aluminium film of etching, the aluminium film of reservation blocked area, described blocked area is the zone corresponding with the mark position of wafer identification code.

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