Method for forming double-mosaic structure

Method for forming double-mosaic structure

  • CN 102,222,639 A
  • Filed: 04/14/2010
  • Published: 10/19/2011
  • Est. Priority Date: 04/14/2010
  • Status: Active Grant
First Claim
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1. the formation method of a dual-damascene structure is characterized in that, comprising:

  • Substrate is provided, is formed with dielectric layer on the described substrate, described dielectric layer is carried out etching, form the through hole that exposes substrate surface;

    The dielectric layer that is positioned between through hole is carried out etching, and to form groove, described groove is used to connect adjacent through hole;

    Dielectric layer between described through hole is repaired etching, make it have smooth surface, include carbon fluorine ratio in the described etching gas more than or equal to 1;

    2 gas.

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