Method for forming double-mosaic structure

Method for forming double-mosaic structure

  • CN 102,222,639 B
  • Filed: 04/14/2010
  • Issued: 03/11/2015
  • Est. Priority Date: 04/14/2010
  • Status: Active Grant
First Claim
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1. a formation method for dual-damascene structure, is characterized in that, comprising:

  • Substrate is provided, described substrate is formed with dielectric layer, described dielectric layer is etched, form the through hole exposing substrate surface;

    Etch the dielectric layer be positioned between through hole, to form groove, described groove is for connecting adjacent through hole, and the dielectric layer surface between the through hole being positioned at described beneath trenches is rough, has projection;

    Reparation etching is carried out to the dielectric layer between described through hole, makes it have smooth surface, in described etching gas, include the gas that carbon fluorine ratio is more than or equal to 1;

    2.

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