Epoxy resin composition and prepreg and printed circuit board (PCB) manufactured therefrom

Epoxy resin composition and prepreg and printed circuit board (PCB) manufactured therefrom

  • CN 102,234,409 A
  • Filed: 04/29/2010
  • Published: 11/09/2011
  • Est. Priority Date: 04/29/2010
  • Status: Active Application
First Claim
Patent Images

1. a composition epoxy resin comprises:

  • (A) 100 parts by weight of epoxy resin;

    And (B) composite hardener, be benchmark with the epoxy compounds of 100 weight parts, it contains the Dicyanodiamide of the amido triazine resol and 0.1 to 8 weight part of 30 to 50 weight parts.

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