Integrated circuit element and packaging component

Integrated circuit element and packaging component

  • CN 102,237,317 A
  • Filed: 10/28/2010
  • Published: 11/09/2011
  • Est. Priority Date: 04/29/2010
  • Status: Active Application
First Claim
Patent Images

1. integrated circuit component comprises:

  • The semiconductor substrate;

    One conductive pole was arranged on this semiconductor-based end, had a sidewall surfaces and a upper surface;

    One projection lower metal layer is arranged between this semiconductor-based end and this conductive pole, has this sidewall surfaces that a surf zone is abutted to this conductive pole and is extended by this sidewall surfaces;

    AndOne protection structure is arranged on this sidewall surfaces of this copper post on this surf zone with this projection lower metal layer,Wherein this protection structure is formed by nonmetallic materials, and this conductive pole is formed by copper containing layer.

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