Arrangement of two substrates having a SLID bond and method for producing such an arrangement

Arrangement of two substrates having a SLID bond and method for producing such an arrangement

  • CN 102,245,498 A
  • Filed: 10/19/2009
  • Published: 11/16/2011
  • Est. Priority Date: 12/09/2008
  • Status: Active Application
First Claim
Patent Images

1. device (1) that has by means of SLID (counterdiffusion of the solid-liquid phase) bonding connection (15) interconnective first (5) and second substrate (10), wherein SLID bonding connection (15) comprises first metal material and second metal material, it is characterized in that SLID bonding connection (15) comprises intermetallic Al/Sn phase (15c).

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×