Package system

Package system

  • CN 102,263,090 A
  • Filed: 12/06/2010
  • Published: 11/30/2011
  • Est. Priority Date: 05/26/2010
  • Status: Active Application
First Claim
Patent Images

1. package system comprises:

  • One first intermediary layer, wherein this first intermediary layer comprises;

    One first internal connection-wire structure;

    One first substrate is arranged on this first internal connection-wire structure, and wherein this first substrate comprises that at least one first silicon perforation structure is formed at wherein;

    AndOne mould envelope compound-material is arranged on this first internal connection-wire structure and around this first substrate;

    AndOne first integrated circuit is arranged on this first intermediary layer, wherein this first integrated circuit and this first silicon perforation structure electrical couplings.

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