Epoxy resin composition with high thermal resistance and high ductility, and preparation method thereof

Epoxy resin composition with high thermal resistance and high ductility, and preparation method thereof

  • CN 102,268,174 A
  • Filed: 06/04/2010
  • Published: 12/07/2011
  • Est. Priority Date: 06/04/2010
  • Status: Active Application
First Claim
Patent Images

1. composition epoxy resin includes the following component of blend:

  • Resins, epoxy, 100 weight parts;

    Acid anhydride type curing agent, 30~

    120 weight parts, preferred 50~

    90 weight parts;

    Paracril, 1~

    45 weight part, preferred 2~

    29 weight parts, more preferably 3~

    25 weight parts, most preferably 3~

    19 weight parts;

    Do not contain curing catalyst in the described composition.

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