Method for manufacturing chip components

Method for manufacturing chip components

  • CN 102,280,238 A
  • Filed: 05/19/2011
  • Published: 12/14/2011
  • Est. Priority Date: 05/19/2011
  • Status: Active Application
First Claim
Patent Images

1. the manufacture method of chip components and parts is characterized in that may further comprise the steps:

  • (1) prepares the substrate of size greater than the preassigned size;

    (2) adopt laserscribing, around aforesaid substrate, draw the housing line by the preassigned size;

    (3) remove the substrate of remaining preassigned size along the housing line part that substrate is unnecessary.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×