Semiconductor die attachment method using non-conductive screen print and dispense adhesive

Semiconductor die attachment method using non-conductive screen print and dispense adhesive

  • CN 102,282,658 A
  • Filed: 05/21/2010
  • Published: 12/14/2011
  • Est. Priority Date: 05/27/2009
  • Status: Active Application
First Claim
Patent Images

1. method that is used for semiconductor die is attached to lead frame die attached oar shape part said method comprising the steps of:

  • Electrically non-conductive material is applied to the back side of semiconductor integrated circuit wafer, and described semiconductor integrated circuit wafer comprises a plurality of integrated circuit dies;

    Heat described semiconductor integrated circuit wafer and position described electrically non-conductive material thereon till described electrically non-conductive material is by hard curing;

    Described semiconductor integrated circuit wafer is installed on the chip carrier;

    The hard electrically non-conductive material that solidifies of wherein said warp is between described semiconductor integrated circuit wafer and described chip carrier;

    In described a plurality of integrated circuit dies each is separated from one another;

    On the face of the die attached oar shape part of a plurality of lead frames, apply non-conductive adhesive;

    Described a plurality of integrated circuit dies are placed in the described non-conductive adhesive on described of corresponding oar shape part in the described die attached oar shape part;

    Heat described a plurality of integrated circuit die and die attached oar shape part till described non-conductive adhesive is by hard curing;

    The joint sheet of described a plurality of integrated circuit dies is attached to the corresponding conductive lead wire of described a plurality of lead frames by closing line;

    AndIn described a plurality of lead frames each is separated into some integrated circuits.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×