Method for manufacturing electronic component

Method for manufacturing electronic component

  • CN 102,290,240 A
  • Filed: 05/06/2011
  • Published: 12/21/2011
  • Est. Priority Date: 05/07/2010
  • Status: Active Grant
First Claim
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1. the manufacture method of an electronic unit is characterized in that,Possess the solder layer that on the surface of the terminal electrode that is formed at electronic unit, forms solder layer and form operation,Described solder layer forms operation to be possessed:

  • The solder attachment operation, described electronic unit be impregnated in the groove of having put into 2 layers the liquid that is separated into the upper and lower, and adhere to fusion welding in the mode of the terminal electrode that covers this electronic unit, described upper strata is made of the surface treatment liquid that has used saturated fatty acid, and described lower floor is made of the fusion weld feed liquid;

    AndScolder is removed operation, when the liquid level on described upper strata is mentioned described electronic unit, prevent fluid near the oxidation towards the temperature more than the fusing point of the described electronic unit spraying fusion welding described liquid level, remove the remainder of the fusion welding that is attached to described terminal electrode.

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