Method for manufacturing electronic component

Method for manufacturing electronic component

  • CN 102,290,240 B
  • Filed: 05/06/2011
  • Issued: 03/25/2015
  • Est. Priority Date: 05/07/2010
  • Status: Active Grant
First Claim
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1. a manufacture method for electronic unit, is characterized in that,Possess the solder layer formation process forming solder layer on the surface of the terminal electrode being formed at multiple electronic unit, described multiple electronic unit is pre-configured in substrate,Described solder layer formation process possesses:

  • Solder attachment operation, described electronic unit be impregnated in the groove of the liquid having put into 2 layers that are separated into the upper and lower, and adhere to fusion welding in the mode of the terminal electrode covering this electronic unit, described upper strata is made up of the surface treatment liquid employing saturated fatty acid, and described lower floor is made up of fusion weld feed liquid;

    AndSolder removing step, when mentioning described electronic unit from the liquid level on described upper strata, towards the anti-fluid of oxidation of the temperature more than fusing point of described electronic unit spraying molten solder near described liquid level, remove the remainder being attached to the fusion welding of described terminal electrodeWhen spraying the anti-fluid of described oxidation to described electronic unit, untreated electronic unit is made to be arranged in the surface treatment liquid on described upper strata,Generally perpendicularly mention described electronic unit from the liquid level on described upper strata, and from oblique upper, the anti-fluid of described oxidation is sprayed to described electronic unit.

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