Method for structuring a semiconductor surface, and semiconductor chip

Method for structuring a semiconductor surface, and semiconductor chip

  • CN 102,308,396 A
  • Filed: 01/22/2010
  • Published: 01/04/2012
  • Est. Priority Date: 02/10/2009
  • Status: Active Application
First Claim
Patent Images

1. method that is used for the structuring semiconductor surface has following steps:

  • -first wafer (1) is provided, it has patterned surface (11);

    -second semiconductor wafer (3) is provided;

    -photoresist (2) is applied on the outer surface of second semiconductor wafer (3);

    -be impressed in the photoresist (2) the surface structuration that deviates from second semiconductor wafer (3) through patterned surface (11) with photoresist (2) with first wafer (1);

    -structural method (6) is applied on the patterned surface (21) of photoresist (2), wherein-will be applied on the photoresist (2) structure at least local metastasis to the outer surface (31) of second semiconductor wafer (3).

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