Chip fanning out method and chip-on-film device

Chip fanning out method and chip-on-film device

  • CN 102,315,137 A
  • Filed: 12/17/2010
  • Published: 01/11/2012
  • Est. Priority Date: 07/08/2010
  • Status: Active Application
First Claim
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1. chip circuit fan-out method comprises:

  • One chip is installed on a film;

    On this film, form a plurality of outer pin binding sites, wherein this a plurality of outer pin binding sites are arranged according to the piece correspondence of dashing forward in proper order;

    On this chip, form a plurality of evagination pieces that connect, wherein these a plurality of even evagination pieces put in order according to a prominent piece and arrange;

    AndForm circuit outside many companies, with should be a plurality of outer pin binding sites according to should the corresponding order of prominent piece being connected to this a plurality of evagination pieces that connect,It is characterized in that the corresponding order of this prominent piece is different from this prominent piece and puts in order, and circuit is not staggered outside these many companies.

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