Semiconductor storage and manufacture method thereof

Semiconductor storage and manufacture method thereof

  • CN 102,315,225 B
  • Filed: 06/29/2011
  • Issued: 08/24/2016
  • Est. Priority Date: 06/29/2010
  • Status: Active Grant
First Claim
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1. a semiconductor storage, it is inserted in external equipment, it is characterised in that possess:

  • Organic substrate, it is provided with external connection terminals in a face;

    Lead frame, it has mounting portion and adhesive portion, described mounting portion mounting semiconductor memory coreSheet, described adhesive portion with from aforementioned mounting portion towards the direction of insertion side of said external equipment extendedMode is formed and is adhered to another face of aforementioned organic substrate;

    Semiconductor memory chips, it is placed in aforementioned mounting portion;

    AndResin mold section, it makes said external connect terminal to expose and encapsulate aforementioned organic substrate, aforementionedLead frame and aforesaid semiconductor memory chip, and its basic square in shape of vertical view;

    Wherein, aforementioned organic substrate is singulated as when being adhered to aforementioned adhesive portion, vertical viewAforementioned organic substrate this side of part nonoverlapping with aforementioned mounting portion is than aforementioned organic substrate and aforementioned loadPut the shape that the overlapping part in portion is big;

    Aforementioned adhesive portion, in the end of aforementioned direction of insertion is formed at aforementioned resin molding section, aforementioned is drawnWire frame, in aforementioned adhesive portion, the most only has the 1st extension, and the 1st extension extends toThe face that the face from aforementioned direction of insertion side of aforementioned resin molding section is different, aforementioned adhesive portion is not to arriveThe length in the face of the aforementioned direction of insertion side of aforementioned resin molding section is formed.

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