Improved heat-dissipating structure

Improved heat-dissipating structure

  • CN 102,338,584 A
  • Filed: 07/23/2010
  • Published: 02/01/2012
  • Est. Priority Date: 07/23/2010
  • Status: Active Application
First Claim
Patent Images

1. radiator structure improvement comprises:

  • A body;

    Have an endothermic section and a radiating part;

    Said radiating part has plurality of radiating fins, has a chamber in this endothermic section, and said chamber has plural first diversion division and one first intercommunicating pore group and one second intercommunicating pore group;

    Said first diversion division is spaced institute by plural first baffle and forms;

    Form at least one first flow between said first baffle, at least one end of said first flow is for free end and connects a free space, and said first diversion division and said first flow define an evaporating area jointly;

    Have one second runner in the said radiating fin and define a condensing zone jointly with said radiating fin, said first and second intercommunicating pore group is communicated with this evaporating area and condensing zone;

    A base plate, correspondence covers said chamber.

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