Heat sink device and method of repairing semiconductor device

Heat sink device and method of repairing semiconductor device

  • CN 102,347,241 A
  • Filed: 07/27/2011
  • Published: 02/08/2012
  • Est. Priority Date: 07/28/2010
  • Status: Active Application
First Claim
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1. method of keeping in repair semiconductor device, this method may further comprise the steps:

  • Rotate compression assemblies on the electronic unit that is installed on the substrate, to exert pressure;

    Radiator is moved with respect to said electronic unit in the horizontal, and said radiator is arranged on the said electronic unit across binder course;

    AndThrough shearing said binder course with said compression assemblies and said radiator being removed from said electronic unit.

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