Polyamide moulding composition of partially aromatic and uses thereof

Polyamide moulding composition of partially aromatic and uses thereof

  • CN 102,372,920 B
  • Filed: 07/21/2011
  • Issued: 04/27/2016
  • Est. Priority Date: 07/23/2010
  • Status: Active Grant
First Claim
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1. there is the polyamide moulding composition of following composition:

  • (A) 62 ~ 87 % by weight partially aromatic, the copolyamide of partial crystallization, described copolyamide fusing point is 270 DEG C ~ 320 DEG C and is made up of such as lower part;

    The diacid fraction of 100 % by weight, described diacid fraction is made up of following component;

    The terephthalic acid (TPA) of 50 ~ 100 % by weight and/or naphthalic acid;

    The m-phthalic acid (IPA) of 0 ~ 50 % by weightWith the diamine portion of 100 % by weight, described diamine portion is selected from following diamines by least one and forms;

    Butanediamine, pentamethylene diamine, hexanediamine, octamethylenediamine, methyl octamethylenediamine, nonamethylene diamine, decamethylene diamine, undecane diamines and dodecamethylene diamine;

    (B) ionomer of 5 ~ 15 % by weight;

    (C) fire retardant of 8 ~ 18 % by weight;

    (D) additive of 0 ~ 5 % by weight;

    Wherein component (A) ~ (D) adds up to 100 % by weight.

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