Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor device
Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor device
- CN 102,373,020 A
- Filed: 07/29/2011
- Published: 03/14/2012
- Est. Priority Date: 07/30/2010
- Status: Active Application
- EN CH
-
- Pin
