Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
- CN 102,408,544 A
- Filed: 11/14/2007
- Published: 04/11/2012
- Est. Priority Date: 11/15/2006
- Status: Active Grant
- EN CH
-
- Pin
