Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

  • CN 102,408,544 A
  • Filed: 11/14/2007
  • Published: 04/11/2012
  • Est. Priority Date: 11/15/2006
  • Status: Active Grant
First Claim
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1. a luminous reflectance is used hot curing resin composition, it is characterized in that, (B) solidifying agent that contain (A) epoxy resin, together uses with said (A) epoxy resin and (E) white pigment,Said (B) solidifying agent contains the hexanaphthene tricarboxylic acid anhydride,Said hexanaphthene tricarboxylic acid anhydride is the compound by following structural formula (I) expression,

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