Powder metallurgy preparation method for electronic encapsulation material with high thermal conductivity

Powder metallurgy preparation method for electronic encapsulation material with high thermal conductivity

  • CN 102,433,456 A
  • Filed: 12/15/2011
  • Published: 05/02/2012
  • Est. Priority Date: 12/15/2011
  • Status: Active Grant
First Claim
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1. the method for preparing powder metallurgy of a high-thermal conductivity electronic packaging material adopts the heat conduction enhancing body (R) of single particle size to it is characterized in that the equivalent volume particle diameter (D of the two as starting material with metallic matrix (M) powder R, D M), numbers of particles (N R, N M) satisfy simultaneously following the relation:

  • (N R/N M

    (D R/D M) 3

    V R/(1-V R) N R/N M

    1 D R/D M

    (V R/(1-V R)) 1/3Wherein, V RBe the volume content of heat conduction enhancing body, N R/ N MAnd D R/ D MBe respectively numbers of particles that heat conduction strengthens body and metallic matrix than and the grain diameter ratio.

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