Bonding film based on epoxide or adhesive tape

Bonding film based on epoxide or adhesive tape

  • CN 102,449,085 B
  • Filed: 12/03/2009
  • Issued: 11/02/2016
  • Est. Priority Date: 05/28/2009
  • Status: Active Grant
First Claim
Patent Images

1. , for the method connecting pipeline, the first pipeline includes the end that can receive second pipe end, is applied to by bonding filmThe end of described second pipe, is incorporated into the first pipe end by the second pipe end being applied with bonding film, and by describedBonding film is heating and curing,Wherein by heat curable adhesive be used as described bonding film, the thickness of described bonding film in the range of 0.1mm to 5mm,Described binding agent contains:

  • A) at least one reactive epoxy prepolymer,B) at least one is for the latent curing agent of epoxide, andC) one or more elastomers,Wherein said elastomer is selected from the block copolymer with thermoplastic polymer block, and described block copolymer is selected from havingThe copolymer of following block structure;

    Styrene-butadiene-(methyl) acrylate,Ethylene-(methyl) acrylate-(methyl) glycidyl acrylate,Ethylene-(methyl) acrylate-maleic anhydride,Methyl methacrylate-butyl acrylate-methyl methacrylate,Wherein exist and there is reactive epoxy groups and at the epoxy resin that 22 DEG C is solid as at least part of component a),AndWherein said bonding film contains the non-reacted polyurethane of thermoplasticity as other elastomer, and described thermoplasticity is non-reactedPolyurethane meets at least one in following condition;

    I) it is solid at 22 DEG C, and glass transition temperature is less than-20 DEG C;

    Ii) it is solid at 22 DEG C, and the starting point of the fusion range that records through Kofler method or softening range is higher than 100 DEG C;

    Iii) it is solid at 22 DEG C, and as pure material, its elongation at break is at least 300%.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×