The UV exposure methods remained in adhesive tape technique are removed for reducing

The UV exposure methods remained in adhesive tape technique are removed for reducing

  • CN 102,456,563 B
  • Filed: 06/17/2011
  • Issued: 10/24/2017
  • Est. Priority Date: 10/19/2010
  • Status: Active Grant
First Claim
Patent Images

1. a kind of method that adhesive tape on semiconductor wafer is exposed, including:

  • The adhesive tape of chip and adhesion on the wafer is provided, wherein the adhesive tape includes the main table perpendicular to first directionFace;

    AndThe adhesive tape is exposed using light so that the adhesive tape loses adhesion, wherein the step of exposing the adhesive tape is wrappedInclude:

    When the light is exposed to the adhesive tape, the chip is rotated and described along the first direction by transferring armAdhesive tape;

    And, project on the adhesive tape with making the Ray obliquity, wherein the main projecting direction of the light and described firstDirection forms the inclination angle more than 10 ° and

    less than 45 °

    , wherein, it is exposed to the adhesive tape in step, the transferring arm edgeMobile guide part is moved, and the inclination angle is formed between the moving direction of the transferring arm and the main surface of the adhesive tape.

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