Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern

Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern

  • CN 102,472,969 A
  • Filed: 07/27/2010
  • Published: 05/23/2012
  • Est. Priority Date: 07/29/2009
  • Status: Active Application
First Claim
Patent Images

1. photosensitive polymer combination;

  • It contains;

    (a) contain carboxylic acid;

    And acid equivalent is 100~

    600;

    Weight-average molecular weight is 5;

    000~

    500;

    000 alkali-soluble macromolecule;

    20~

    80 quality %;

    (b) contain at least a kind of unsaturated addition polymerization property monomer of olefinic;

    5~

    60 quality % with compound of acryloyl group;

    (c) contain the Photoepolymerizationinitiater initiater of N-aryl-alpha-amino acid compound;

    0.1~

    20 quality %;

    (d) leuco dye;

    0.1~

    10 quality %;

    (e) the dimercaptothiodiazole compound of formula (I) expression;

    0.01~

    5 quality %

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