Adhesive sheet for semiconductor device and manufacturing method thereof

Adhesive sheet for semiconductor device and manufacturing method thereof

  • CN 102,543,811 A
  • Filed: 09/27/2011
  • Published: 07/04/2012
  • Est. Priority Date: 12/13/2010
  • Status: Active Application
First Claim
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1. an adhesive sheet that is used for semiconductor device comprises the release element, knitting layer, pressure sensitive adhesive layer and the basement membrane that stack gradually,Wherein said release element comprises first cutting part that the periphery from the horizontal side of said knitting layer along said knitting layer forms and second cutting part that forms along the periphery of said pressure sensitive adhesive layer and said basement membrane,The thickness separately of said first cutting part and said second cutting part is less than the thickness of said release element,Said release element has the shear strength in 40N/15mm to the 90N/15mm scope.

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