Micromachined microphone and multisensor and method for producing same

Micromachined microphone and multisensor and method for producing same

  • CN 102,572,662 A
  • Filed: 04/21/2006
  • Published: 07/11/2012
  • Est. Priority Date: 04/25/2005
  • Status: Active Grant
First Claim
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1. microphone comprises:

  • The wafer that comprises conductive backings, said backboard has the opening towards the backside cavity of said wafer;

    By a plurality of conductive diaphragm characteristics that said backboard is supported, said a plurality of conductive diaphragm characteristics comprise;

    ambient, barrier film and at least one are coupled to the spring of said ambient with said barrier film, and said barrier film and said ambient are spaced apart, andAt least one oxide skin(coating) between said backboard and said ambient, so that said barrier film of electrical isolation and said backboard, wherein said backboard and said barrier film ability capacitive coupling are to be used to respond to the vibration of said barrier film.

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