For the chip bearing apparatus of semiconductor wafer fabrication process

For the chip bearing apparatus of semiconductor wafer fabrication process

  • CN 102,593,035 B
  • Filed: 08/07/2009
  • Issued: 03/30/2016
  • Est. Priority Date: 08/08/2008
  • Status: Active Grant
First Claim
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1. , for a chip bearing apparatus for semiconductor wafer fabrication process, comprising:

  • One heat-conducting layer, be arranged on a supporting base, this heat-conducting layer is coupled to a heater circuit;

    Multiple hole, one first through this heat-conducting layer and multiple hole described in each extends in this supporting base;

    The air cylinder of multiple elastomeric spring or sealing, correspondence is arranged in this first of multiple hole described in each, and a first end of the air cylinder of multiple elastomeric spring or sealing described in each is supported by a basal surface of hole multiple described in each, or the air cylinder of multiple elastomeric spring or sealing described in each is the air cylinder being arranged at an elastomeric spring on a hoistable platform or a sealing, and this hoistable platform hangs from the top of a lift motor module;

    AndMultiple heat conduction support bar, by one second end of the air cylinder of elastomeric spring multiple described in each or sealing as support, multiple heat conduction support bar described in each is electrically coupled to this heater circuit and extends through this hole and exceed this heat-conducting layer, described in each, heat conduction support bar has a top, in order to directly to contact with the wafer be positioned on this heat-conducting layer when chip heats, wherein before wafer fabrication process, this wafer has one first shape, and there is one second shape during this wafer fabrication process, when this wafer has this first shape or this second shape, multiple heat conduction support bar described in each directly to contact with this wafer in order to maintain alone and to heat this wafer.

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