LED packaging method

LED packaging method

  • CN 102,593,319 A
  • Filed: 01/30/2012
  • Published: 07/18/2012
  • Est. Priority Date: 12/20/2011
  • Status: Active Application
First Claim
Patent Images

1. a LED encapsulation method is characterized in that, may further comprise the steps:

  • Light-emitting diode chip for backlight unit is fixed on first of support;

    This support comprises relative first and second;

    Apply welding material in the specific region of substrate, second face of the support that is fixed with said light-emitting diode chip for backlight unit is positioned on this welding material;

    Support and substrate pre-fixed make it that relative displacement not take place in follow-up step;

    Heating makes said welding material fusing, and the welding of cooling back realization substrate and support is fixed.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×