Large Area Plasma Processing Chamber With At-electrode Rf Matching

Large Area Plasma Processing Chamber With At-electrode Rf Matching

  • CN 102,598,876 A
  • Filed: 11/17/2010
  • Published: 07/18/2012
  • Est. Priority Date: 11/17/2009
  • Status: Active Application
First Claim
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1. plasma process system comprises:

  • Chamber body, said chamber body have chamber sidewall, bottom and the cap assemblies that defines the processing space, and said cap assemblies is supported by said chamber sidewall;

    Substrate support, said substrate support are disposed in the processing space of said chamber body;

    Electrode, said electrode are disposed near the said substrate support, top or front, to excite the gas in the said processing space;

    AndAt least one RF tuned cell, said RF tuned cell is coupled to said electrode, and said tuned cell is disposed between the ground connection cover piece or sidewall and said electrode of said cap assemblies.

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