Composition epoxy resin and semiconductor device

Composition epoxy resin and semiconductor device

  • CN 102,617,981 B
  • Filed: 11/25/2005
  • Issued: 12/14/2016
  • Est. Priority Date: 11/30/2004
  • Status: Active Grant
First Claim
Patent Images

1. for the composition epoxy resin of packaged semiconductor, comprising:

  • (A) crystalline epoxy resin that formula (4) represents;

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